询价5SGXMB6R3F40C4N封装为准¥19509.10去看看盛德信科技发布了芯片配套 IC供应 5SGXMB6R3F40C4N 封装1517-FBGA 价询价为准询价5SGXMB6R2F40C2N封装为准¥321930去看看盛德信科技发布了芯片配套 IC供应 5SGXMB6R2F40C2N 封装1517-FBGA 价询价为准询价5SGXMB6R2F43C2N封装芯片¥327540去看看盛德信科技发布了芯片配套 IC供应 5SGXMB6R2F43C2N 封装1760-FBGA, FC 价询价为询价封装芯片配套¥327540去看看盛德信科技发布了芯片配套 IC供应 5SGXMB6R2F43I3LN 封装1760-FBGA, FC 价询价询价5SGXMB5R2F43C1N封装芯片¥34659.20去看看盛德信科技发布了芯片配套 IC供应 5SGXMB5R2F43C1N 封装1760-FBGA, FC 价询价为询价5SGXMB5R3F40C3N封装为准¥205800去看看盛德信科技发布了芯片配套 IC供应 5SGXMB5R3F40C3N 封装1517-FBGA 价询价为准询价封装为准芯片¥27165.20去看看盛德信科技发布了芯片配套 IC供应 5SGXMB5R2F40C2LN 封装1517-FBGA 价询价为准询价封装为准芯片¥29265.10去看看盛德信科技发布了芯片配套 IC供应 5SGXMB6R3F40C2LN 封装1517-FBGA 价询价为准询价5SGXMB5R3F40I4N封装为准¥205800去看看盛德信科技发布了芯片配套 IC供应 5SGXMB5R3F40I4N 封装1517-FBGA 价询价为准询价5SGXMB9R3H43C2N封装为准¥36162.10去看看盛德信科技发布了芯片配套 IC供应 5SGXMB9R3H43C2N 封装1760-HBGA 价询价为准询价5SGXMB9R3H43I3N封装为准¥36162.10去看看盛德信科技发布了芯片配套 IC供应 5SGXMB9R3H43I3N 封装1760-HBGA 价询价为准询价5SGXMB6R1F43C1N封装芯片¥44664.20去看看盛德信科技发布了芯片配套 IC供应 5SGXMB6R1F43C1N 封装1760-FBGA, FC 价询价为询价5SGXMB5R2F40I3N封装为准¥27165.20去看看盛德信科技发布了芯片配套 IC供应 5SGXMB5R2F40I3N 封装1517-FBGA 价询价为准询价封装芯片配套¥25206.20去看看盛德信科技发布了芯片配套 IC供应 5SGXMB5R3F43C2LN 封装1760-FBGA, FC 价询价询价封装为准芯片¥24696.10去看看盛德信科技发布了芯片配套 IC供应 5SGXMB5R3F40C2LN 封装1517-FBGA 价询价为准询价5SGXMB5R2F43I3N封装芯片¥277290去看看盛德信科技发布了芯片配套 IC供应 5SGXMB5R2F43I3N 封装1760-FBGA, FC 价询价为询价5SGXMB6R3F40I3N封装为准¥29265.10去看看盛德信科技发布了芯片配套 IC供应 5SGXMB6R3F40I3N 封装1517-FBGA 价询价为准询价5SGXMB5R3F43I4N封装芯片¥21006.20去看看盛德信科技发布了芯片配套 IC供应 5SGXMB5R3F43I4N 封装1760-FBGA, FC 价询价为询价5SGXMB5R1F40C2N封装为准¥29637.10去看看盛德信科技发布了芯片配套 IC供应 5SGXMB5R1F40C2N 封装1517-FBGA 价询价为准询价封装芯片配套¥327540去看看盛德信科技发布了芯片配套 IC供应 5SGXMB6R2F43C2LN 封装1760-FBGA, FC 价询价询价5SGXMB5R2F40C3N封装为准¥22638.20去看看盛德信科技发布了芯片配套 IC供应 5SGXMB5R2F40C3N 封装1517-FBGA 价询价为准询价5SGXMB5R1F43C2N封装芯片¥30249.20去看看盛德信科技发布了芯片配套 IC供应 5SGXMB5R1F43C2N 封装1760-FBGA, FC 价询价为询价5SGXMB5R2F43C2N封装芯片¥277290去看看盛德信科技发布了芯片配套 IC供应 5SGXMB5R2F43C2N 封装1760-FBGA, FC 价询价为询价封装为准芯片¥43395.10去看看盛德信科技发布了芯片配套 IC供应 5SGXMB9R1H43C2LN 封装1760-HBGA 价询价为准询价5SGXMB6R3F40C3N封装为准¥243870去看看盛德信科技发布了芯片配套 IC供应 5SGXMB6R3F40C3N 封装1517-FBGA 价询价为准询价封装为准芯片¥296340去看看盛德信科技发布了芯片配套 IC供应 5SGXMB5R1F40C2LN 封装1517-FBGA 价询价为准询价5SGXMB5R3F43C3N封装芯片¥210060去看看盛德信科技发布了芯片配套 IC供应 5SGXMB5R3F43C3N 封装1760-FBGA, FC 价询价为询价5SGXMB6R3F43C4N封装芯片¥198510去看看盛德信科技发布了芯片配套 IC供应 5SGXMB6R3F43C4N 封装1760-FBGA, FC 价询价为询价封装为准芯片¥46410.30去看看盛德信科技发布了芯片配套 IC供应 5SGXMB9R2H43I2LN 封装1760-HBGA 价询价为准询价5SGXMB9R3H43C4N封装为准¥24108.10去看看盛德信科技发布了芯片配套 IC供应 5SGXMB9R3H43C4N 封装1760-HBGA 价询价为准询价5SGXMB9R2H43C3N封装为准¥331500去看看盛德信科技发布了芯片配套 IC供应 5SGXMB9R2H43C3N 封装1760-HBGA 价询价为准询价5SGXMB9R1H43C2N封装为准¥43395.10去看看盛德信科技发布了芯片配套 IC供应 5SGXMB9R1H43C2N 封装1760-HBGA 价询价为准询价封装为准芯片¥40971.30去看看盛德信科技发布了芯片配套 IC供应 5SGXMB6R1F40I2LN 封装1517-FBGA 价询价为准询价5SGXMB5R3F40I3N封装为准¥24696.10去看看盛德信科技发布了芯片配套 IC供应 5SGXMB5R3F40I3N 封装1517-FBGA 价询价为准询价5SGXMB6R2F40C3N封装为准¥26826.10去看看盛德信科技发布了芯片配套 IC供应 5SGXMB6R2F40C3N 封装1517-FBGA 价询价为准询价封装为准芯片¥397770去看看盛德信科技发布了芯片配套 IC供应 5SGXMB9R2H43C2LN 封装1760-HBGA 价询价为准询价封装芯片配套¥38211.10去看看盛德信科技发布了芯片配套 IC供应 5SGXMB6R2F43I2LN 封装1760-FBGA, FC 价询价询价5SGXMB6R1F40C1N封装为准¥43896.10去看看盛德信科技发布了芯片配套 IC供应 5SGXMB6R1F40C1N 封装1517-FBGA 价询价为准询价5SGXMB6R2F43I2N封装芯片¥38211.10去看看盛德信科技发布了芯片配套 IC供应 5SGXMB6R2F43I2N 封装1760-FBGA, FC 价询价为询价5SGXMB5R3F43I3N封装芯片¥25206.20去看看盛德信科技发布了芯片配套 IC供应 5SGXMB5R3F43I3N 封装1760-FBGA, FC 价询价为询价封装为准芯片¥35118.20去看看盛德信科技发布了芯片配套 IC供应 5SGXMB6R1F40C2LN 封装1517-FBGA 价询价为准询价封装为准芯片¥397770去看看盛德信科技发布了芯片配套 IC供应 5SGXMB9R2H43I3LN 封装1760-HBGA 价询价为准询价5SGXMB5R3F43C2N封装芯片¥25206.20去看看盛德信科技发布了芯片配套 IC供应 5SGXMB5R3F43C2N 封装1760-FBGA, FC 价询价为询价封装芯片配套¥297750去看看盛德信科技发布了芯片配套 IC供应 5SGXMB6R3F43C2LN 封装1760-FBGA, FC 价询价询价封装芯片配套¥30249.20去看看盛德信科技发布了芯片配套 IC供应 5SGXMB5R1F43C2LN 封装1760-FBGA, FC 价询价询价封装芯片配套¥277290去看看盛德信科技发布了芯片配套 IC供应 5SGXMB5R2F43C2LN 封装1760-FBGA, FC 价询价可编程门阵列5SGXMB6R2F40C3N封装¥142.80去看看瑞邦福小店发布了5SGXMB6R2F40C3N C2N C1N封装BGA1517 可编程门阵列 ALTERA芯片询价封装芯片配套¥32349.20去看看盛德信科技发布了芯片配套 IC供应 5SGXMB5R2F43I2LN 封装1760-FBGA, FC 价询价询价5SGXMB5R3F40C2N封装为准¥24696.10去看看盛德信科技发布了芯片配套 IC供应 5SGXMB5R3F40C2N 封装1517-FBGA 价询价为准询价5SGXMB9R3H43I4N封装为准¥30135.10去看看盛德信科技发布了芯片配套 IC供应 5SGXMB9R3H43I4N 封装1760-HBGA 价询价为准询价封装芯片配套¥297750去看看盛德信科技发布了芯片配套 IC供应 5SGXMB6R3F43I3LN 封装1760-FBGA, FC 价询价询价5SGXMB6R3F43I3N封装芯片¥297750去看看盛德信科技发布了芯片配套 IC供应 5SGXMB6R3F43I3N 封装1760-FBGA, FC 价询价为询价5SGXMB6R2F43C1N封装芯片¥40941.20去看看盛德信科技发布了芯片配套 IC供应 5SGXMB6R2F43C1N 封装1760-FBGA, FC 价询价为询价5SGXMB6R1F43C2N封装芯片¥35730.20去看看盛德信科技发布了芯片配套 IC供应 5SGXMB6R1F43C2N 封装1760-FBGA, FC 价询价为询价5SGXMB6R2F40C1N封装为准¥40239.20去看看盛德信科技发布了芯片配套 IC供应 5SGXMB6R2F40C1N 封装1517-FBGA 价询价为准询价5SGXMB5R1F40C1N封装为准¥37044.10去看看盛德信科技发布了芯片配套 IC供应 5SGXMB5R1F40C1N 封装1517-FBGA 价询价为准询价5SGXMB5R3F40C4N封装为准¥16464.10去看看盛德信科技发布了芯片配套 IC供应 5SGXMB5R3F40C4N 封装1517-FBGA 价询价为准询价5SGXMB5R2F40I2N封装为准¥31692.20去看看盛德信科技发布了芯片配套 IC供应 5SGXMB5R2F40I2N 封装1517-FBGA 价询价为准询价5SGXMB9R1H43I2N封装为准¥50628.20去看看盛德信科技发布了芯片配套 IC供应 5SGXMB9R1H43I2N 封装1760-HBGA 价询价为准询价5SGXMB5R2F43I2N封装芯片¥32349.20去看看盛德信科技发布了芯片配套 IC供应 5SGXMB5R2F43I2N 封装1760-FBGA, FC 价询价为